1/8 www.rohm.com 2012.02 - rev. a ? 2012 rohm co., ltd. all rights reserved. stepping motor driver series microstep 36v series stepping motor driver BD63860EFV description BD63860EFV is a high-grade stepping motor driver with an intern al 3-bit dac, designed to drive bipolar stepping motors in eighth-step modes. the ic features severa l integrated protection circuits and ac hieves excellent thermal dissipation performance due to its low on-resistance dmos output transistors and high-dissipation power package. this ic is rated for 36 v maximum input voltage / 2.5 a maximum output current and employs a constant-current, pwm allowing for full-, half-, quarter- and eighth-step excitation modes . additionally, the current decay mode can be freely set t o a ratio of fast and slow decay, allowing the ic to adapt to the optimum control conditions for every motor. the single-power supply configuration allows for easy design and layout in the application. features 1) single power supply input (vin max. 36 v) 2) rated output current: 2.5 a (peak) 3) low on-resistance dmos output (0.8 ? total across upper + lower fets) 4) serial/clk-in drive mode (integrated translator circuit) 5) pwm constant-current cont rol (fixed chopping frequency) 6) built-in spike noise cancel function (external noise filter is unnecessary) 7) full-, half-, quarter- and eighth-step functionality 8) auto decay mode 9) current decay mode switching function (linearly variable fast/slow decay ratio) 10) normal rotation & reverse rotation switching function 11) power-save function 12) built-in logic input pull-down resistor 13) power-on reset function 14) thermal shutdown circuit (tsd) 15) over-current protection circuit (ocp) 16) under-voltage lockout circuit (uvlo) 17) over-voltage lockout circuit (ovlo) 18) ghost supply prevention (protects against ma lfunction when power supply is disconnected) 19) micro-miniature, ultra-thin and high heat-radiation (exposed metal type) htssop package applications laser printers, multi-function printers, inkjet printe rs, scanners, mini printers, ppcs, photo printers, etc. no.12009eat09
technical note 2/8 BD63860EFV www.rohm.com 2012.02 - rev. a ? 2012 rohm co., ltd. all rights reserved. absolute maximum ratings (ta = 25c) parameter symbol limit unit supply voltage v cc1,2 -0.2 ? 36.0 v power dissipation pd 1.45 *1 w 4.7 *2 control pin input voltage v in -0.2 ? 7.0 v rnf maximum voltage v rnf 1.0 v maximum output current i out 2.5 *3 a / phase operating temperature range t opr -25 ? 85 c storage temperature range t stg -55 ? 150 c junction temperature t jmax 150 c *1 ic mounted on 70mm x 70mm x 1.6mm glass-epoxy board. derated at 11.6 mw/ ? c above ta = 25c. *2 ic mounted on 4-layer recommended board. derated at 37.6 mw/c above ta = 25c. *3 not to exceed pd, aso and tjmax = 150c. operating conditions (ta = -25 ? 85 c) parameter symbol limit unit min typ max supply voltage v cc1,2 16 24 28 v output current(dc) i out 1.5 1.7 *4 a/phase *4 not to exceed pd, aso. electrical characteristics (unless otherwise specified, ta = 25c, vcc1,2 = 24 v) item symbol limit unit condition min typ max overall device circuit current at standby i ccst - 0.4 2.0 ma ps = l circuit current i cc - 4.0 7.0 ma ps = h, vref = 2 v control inputs (ps, rese t, enable, clk, cw/ccw , mode1, mode2, sr) h level input voltage v inh 2.0 - 5.5 v l level input voltage v inl 0 - 0.8 v h level input current i inh 38 55 94 a v in = 5.5 v l level input current i inl -10 0 - a v in = 0 v outputs (out1a, out1b, out2a, out2b) output on-resistance r on - 0.8 1.0 ? i out = 1.5 a, total across top and bottom fet output leak current i leak - - 10 a current control rnf input current i rnf -40 -20 - a rnf = 0 v vref input current i vref -2.0 -0.1 - a vref = 0 v vref input voltage range v ref 0 - 3.2 v vcr input current i vcr 60 100 140 a v vcr = 3.3 v vcr input voltage range v vcr 3.0 - 5.5 v mth input current i mth -2.0 -0.1 - a mth = 0 v mth input voltage range v mth 0 - 3.5 v comparator threshold 1 v cth1 0.212 0.250 0.288 v vref = 2 v, 100% comparator threshold 2 v cth2 0.142 0.177 0.212 v vref = 2 v, 70.71% comparator threshold 3 v cth3 0.076 0.096 0.116 v vref = 2 v, 38.27% minimum on time t onmin 0.21 0.54 0.92 s r=39k ,c=1000pf
technical note 3/8 BD63860EFV www.rohm.com 2012.02 - rev. a ? 2012 rohm co., ltd. all rights reserved. pin function table no. name function no. name function 1 rnf1 output current-sense resistor connection 15 vcc2 power supply terminal 2 n.c. no connection 16 sr 3 cw/ccw motor rotation direction setting terminal 17 reset reset terminal 4 out1a h-bridge output terminal 18 out2b h-bridge output terminal 5 mth current decay ratio setting terminal 19 clk clock input terminal (f or advancing electrical angle) 6 cr1 pwm frequency setting rc connection 20 test test terminal (connect to gnd during normal use) 7 gnd ground terminal 21 gnd ground terminal 8 vref output current value setting terminal 22 n.c. no connection 9 cr2 pwm frequency setting rc connection 23 n.c. no connection 10 vcr decay mode setting terminal 24 n.c. no connection 11 out2a h-bridge output terminal 25 out1b h-bridge output terminal 12 mode2 motor excitation mode setting terminal 26 enable output enable terminal 13 mode1 motor excitation mode setting terminal 27 ps power save terminal 14 rnf2 output current-sense resistor connection 28 vcc1 power supply terminal block diagram, application circuit, input/output equivalent circuits fig.1 block diagram / application circuit vcc1 bypass capacitors. allowable values: 47 f ? 470 f (electrolytic) 0.01 f ? 0.1 f (multi-layer ceramic) ensure vcc1 and vcc2 are shorted. test terminal. connect to gnd during operation. sets pwm frequency. allowable values: c: 470 pf ? 4700 pf r: 10 k ? ? 100 k ? . output current sense resistor. allowable values: 0.1 ? ? 0.4 ? current limit comp. current limit comp. predriver ocp buffer 28 vcc1 cr timer logic translator dac ocp cr timer predriver dac logic tsd uvlo ovlo reg reset 9 cr2 27 ps 19 clk 12 mode2 13 mode1 6 cr1 5 mth 3 cw_ccw 26 enable vref 8 25 out1b 4 out1a 1 rnf1 15 vcc2 11 out2a 7 gnd 18 out2b 14 rnf2 20 test 17 reset 21 gnd 10 vcr 16 sr sets pwm frequency. allowable values: c: 470 pf ? 4700 pf r: 10 k ? ? 100 k ? . output current sense resistor. allowable values: 0.1 ? ? 0.4 ? refer to p. 8.
technical note 4/8 BD63860EFV www.rohm.com 2012.02 - rev. a ? 2012 rohm co., ltd. all rights reserved. pin descriptions clk ? clock input terminal for advancing output electrical angle clk is triggered at the rising edge of the input clock sig nal. the electrical angle output advances by one step for each clk pulse input. as the motor may misst ep if excessive noise is present on the clk terminal, the traces leading to this pin should be designed such that noise is kept to a minimum. mode1, mode2 ? motor excitation mode terminal sets the motor excitation mode. refer to the following table: mode1 mode2 excitation mode l l full step h l half step a l h quarter step h h eighth step refer to pp. 12-13 for the timing chart and mo tor torque vectors for each excitation mode. changes to this pin are not synchronized with the clk input and will reflect immediately in the operation of the ic (refer to p. 16). cw/ccw ? motor rotation direction setting terminal set the motor?s rotation direction. changes to this pin are reflected at the rising edge of the next immediate clk input pulse after the setting is changed (refer to p. 14). cw/ccw rotation direction l clockwise (channel 2 current is output with a 90 phase-lag relative to channel 1) h counterclockwise (channel 2 current is output with a 90 phase-lead relative to channel 1) enable ? output enable terminal forcibly turns off all output transistors (leaving the motor output open). when enable is set to a logic hi, the output electrical angle and operating mode is mainta ined even if a pulse is input to the clk pin. however, bear in mind that when the enable signal is switched from hi to lo, the output angle may chan ge depending on whether the clk input is hi or lo (refer to p. 15). enable motor output l active h open (electrical angle maintained) ps ? power save terminal switches the ic to standby mode and holds all motor output s open. setting the ic to standby mode reinitializes the translator and resets the output angle to the default position (see bel ow). additionally, when switching from standby to normal mode, a delay of approximately 40 s (max.) occurs before motor output becomes active (refer to p. 11). ps state l standby mode (reset) h active mode the default electrical angle for each excitation mode immediat ely following a reset is as follows (refer to pp. 12-13): excitation mode initial electrical angle full step 45 half step a 45 quarter step 45 eighth step 45
technical note 5/8 BD63860EFV www.rohm.com 2012.02 - rev. a ? 2012 rohm co., ltd. all rights reserved. protection circuits thermal shutdown (tsd) this ic features an integrat ed thermal shutdown for protection against t hermal destruction. when the ic?s chip temperature rises above 175c (typ.), the motor output is forced open. when the temperature returns to 150c or less (typ.), the ic automatically resumes normal operation. however, even if tsd has engaged, the ic may become damaged if heat continues to be abs orbed from an external source. over-current protection (ocp) this ic features an integrated over-cu rrent protection circuit to protect agai nst destruction if the motor outputs are shorted to one another, if vcc is shorted to the motor output, or if the moto r output is shorted to gnd. the circuit latches the motor output open if current flows above the maximum threshold for 4 s (typ.), and is disengaged when the ic is power-cycled or if the ps terminal is reset. the oc p circuitry is designed only to protect the ic from irregular conditions (such as motor output shorts) and is not designed to be used as an active security device for the application. therefore, applications should not be designed under the assumption that this circuitry will engage. after ocp has engaged, if irregular conditions continue after a power cy cle or ps pin reset, ocp may engage repeatedly, causing the ic to generate heat or otherwise suffer damage. if the inductance of the ic?s input/output wiring is large (e.g., due to long trace length), overload current may flow into the wiring before ocp engages, causing a jump in voltage on the input/output pin that may exceed the ic?s absolute maximum rating and damage the ic. additionally, if the ic conducts a current through the output that is larger than the specified output current rating but lower than the ocp threshold, the ic may heat up beyond its maximum rating (t jmax = 150c) and destroy itsel f. therefore, ensure that the set output current does not exceeds the ic?s maximum output rating. under-voltage lockout (uvlo) this ic features an integrated under-volta ge lockout function to prevent against output when powered by an insufficient supply voltage. if the supply voltage connected to the v cc terminal drops below 12 v (typ.), the motor output is forced open. this switching voltage threshold has a hysteresis of 1 v (typ.) to prevent malfunction due to noise on the input. this circuit does not function in power-save mode. also, when driving the ic in serial (clk-in) mode, the output angle is reinitialized to the default angle upon releas e of the uvlo circuitry. over-voltage lockout (ovlo) this ic features an integrated over-v oltage lockout function to prevent against output when powered by a supply voltage exceeding the rated input voltag e range. if the supply voltage connec ted to the vcc terminal reaches 32 v (typ.), the motor output is forced open. this switching voltage threshold ha s a hysteresis of 1 v (typ.) and a noise-masking period of 4 s (typ.) to prevent malfunction due to noise on the input. although the ic features this integrated protection device, it may still be destroyed if the input voltage exceeds the ic?s absolute maximum ratings. this circuit does not operate in power-save mode. ghost supply prevention this ic features integrated ghost suppl y protection circuitry, which prevents the ic from being powered by a logic input when the power supply is disconnected or grounded. this circuitry prevents current from flowing through the integrated esd protection diodes (located be tween logic input pins and the vcc pin) , ensuring that the ic itself or any other peripherals connected to the vcc pin cannot be powered by an input signal on any logic terminals. therefore, the circuit will not malfunction if a logic signal is input to the ic while the power supply is disconnected or grounded.
technical note 6/8 BD63860EFV www.rohm.com 2012.02 - rev. a ? 2012 rohm co., ltd. all rights reserved. power dissipation htssop-b28 package the htssop-b28 package features a heat-r adiating metal slag mounted on the backside of the ic. ensure that the pcb design incorporates large areas of copper to facilitate heat dissipation as much as possible. as the heat slag is shorted with the substrate of the ic di e, ensure that the slag is con nected to gnd. connecting the slag to a potential other than gnd will cause the chip to malf unction. also ensure th at the backside of the chip is completely and fi rmly soldered onto the pcb. the ratings specified in this sheet assume th e ic has been properly mounted and soldered, and that the pcb has been adequately designed to facilitate heat dissipation. fig.2 htssop-b28 derating curve operation notes (1) absolute maximum ratings use of the ic in excess of absolute maximum ratings (such as the input voltage or operating temperature range) may result in damage to the ic. assumptions should not be made regarding the state of the ic (e.g., short mode or open mode) when such damage is suffered. if operational values ar e expected to exceed the maximum ratings for the device, consider adding protective circuitry (such as fuses) to eliminate the risk of damaging the ic. (2) power supply polarity connecting the power supply with a reverse polarity can damage ic. take precautions when connecting the power supply lines. an external diode can be co nnected to the input for extra protection. (3) power supply lines pcb design should allow for low-impedance gnd and supply lines . to minimize noise on these lines, the gnd section and supply lines of the digital and analog blocks should be rout ed separately on the pcb. furthermore, for all power ic supply terminals, a capacitor should be connected between t he power supply and gnd terminal. if using electrolytic capacitors, note that their capacitance val ues may be reduced at lower temperatures. (4) gnd potential the potential of the gnd pin must be the minimum potential in the system in all operating conditions. ensure that no pins are at a voltage below the gnd at any ti me, regardless of transient characteristics. (5) backside heat slag the metal heat slag integrated on the backside of the ic is c onnected internally with the backside of the ic die. therefore, it should always be connected to gnd. connecting to any other potential may cause malfunction or destruction of the ic. (6) thermal design use a thermal design that allows for a sufficient margin for the package?s rated power dissipation (pd) under actual operating conditions. keep in mind that t he packaging of this ic series has been designed with an exposed heat slag on the backside of the package, and that this heat slag should be soldered co mpletely to as broad a gnd pattern as possible (on both the base fin of the slag as well as the entire backsi de) to improve heat dissipation. ambient temperature:ta [c] power dissipation: pd[w] 1.0 100 125 0 4.7w 4 3.3w 3 1.85w 2 1.45w 1 2.0 3.0 4.0 measurement machine: th156 (kuwano electric) measurement conditions: rohm board, 70mm x 70 mm x 1.6 mm board contains through-holes heat slag soldered completely to pcb board : 1-layer board (no copper foil on backside) board : 2-layer board (15 x 15 mm 2 copper foil on backside) board : 2-layer board (70 x 70 mm 2 copper foil on backside) board : 4-layer board (70 x 70 mm 2 copper foil on backside) board : ja = 86.2c / w board : ja = 67.5c / w board : ja = 37.8c / w board : ja = 26.6c / w
technical note 7/8 BD63860EFV www.rohm.com 2012.02 - rev. a ? 2012 rohm co., ltd. all rights reserved. (7) inter-pin shorts and mounting errors use caution when orienting and positioning the ic for mounting on printed circuit boards. improper mounting may result in damage to the ic. shorts between output pins or between output pi ns and the power supply or gnd pins (caused by poor soldering or foreign objects) may result in damage to the ic. (8) actions in strong electromagnetic field the ic is not designed for using in the presence of strong elec tromagnetic field. be sure to confirm that no malfunction is found when using the ic in a strong electromagnetic field. (9) aso ? area of safe operation when using the ic, ensure that operating conditions do not exceed absolute maximum ratings or aso of the output transistors. (10) thermal shutdown circuit the ic incorporates a built-in thermal shutdown circuit, which is designed to force the motor output open if the ic?s internal temperature exceeds tjmax = 150c. it is not designed to protect the ic from damage or guarantee its operation. ics should not be used after this function has activated, or in applications where the operation of this circuit is assumed. tsd on temperature [c] (typ.) hyst eresis temperature [c] (typ.) 175 25 (11) testing on application boards when testing the ic on an application board, connecting a capaci tor directly to a low-impedance pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ic?s power supply should always be turned off completely before connecting or removing it from a jig or fixture during the eval uation process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. (12) input terminal of ic this monolithic ic contains p+ isolati on and p substrate layers between adjacent el ements in order to keep them isolated. pn junctions are formed at the intersection of these p layers with the n layers of other elements, creating parasitic diodes and/or transistors. for example (refer to the figure below): when gnd > pin a and gnd > pin b, the pn junction operates as a parasitic diode when gnd > pin b, the pn junction operates as a parasitic transistor parasitic diodes occur inevitably in the structure of the ic, and the operation of these parasiti c diodes can result in mutual interference among circuits, operational faults, or physical dam age. accordingly, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. fig.3 example of monolithic ic structure (13) ground wiring patterns when using both small-signal and lar ge-current gnd traces, the two ground tr aces should be routed separately but connected to a single ground potential within the application in order to avoid variat ions in the small-signal ground caused by large currents. also ensure that the gnd traces of external components do not cause variations on gnd voltage. the power supply and ground lines must be as short and thick as possible to reduce line impedance. (14) test terminal connect the test pin to gnd during operation. resistor transistor (npn) n n n p + p + p p substrate gnd parasitic element pin a n n p + p + p p substrate gnd parasitic element pin b c b e n gnd pin a p aras iti c element pin b other adjacent elements e b c gnd parasitic element
technical note 8/8 BD63860EFV www.rohm.com 2012.02 - rev. a ? 2012 rohm co., ltd. all rights reserved. ordering part number b d 6 3 8 6 0 ef v -e 2 ??` efv=htssop-b28 ??`?? e2: `???`? ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape (with dry pack) tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin (unit : mm) htssop-b28 0.08 m 0.08 s s 1.0 0.2 0.5 0.15 4 + 6 ? 4 0.17 +0.05 - 0.03 15 28 14 1 (2.9) 4.4 0.1 (5.5) (max 10.05 include burr) 0.625 6.4 0.2 9.7 0.1 1pin mark 1.0max 0.65 0.85 0.05 0.08 0.05 0.24 +0.05 - 0.04
r1120 a www.rohm.com ? 2012 rohm co., ltd. all rights reserved. notice rohm customer support system http://www.rohm.com/contact/ thank you for your accessing to rohm product informations. more detail product informations and catalogs are available, please contact us. notes no copying or reproduction of this document, in part or in whole, is permitted without the consent of rohm co.,ltd. the content specified herein is subject to change for improvement without notice. the content specified herein is for the purpose of introducing rohm's products (hereinafter "products"). if you wish to use any such product, please be sure to refer to the specifications, which can be obtained from rohm upon request. examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the products. the peripheral conditions must be taken into account when designing circuits for mass production. great care was taken in ensuring the accuracy of the information specified in this document. however, should you incur any damage arising from any inaccuracy or misprint of such information, rohm shall bear no responsibility for such damage. the technical information specified herein is intended only to show the typical functions of and examples of application circuits for the produc ts. rohm does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by rohm and other parties. rohm shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. the products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, commu- nication devices, electronic appliances and amusement devices). the products specified in this document are not designed to be radiation tolerant. while rohm always makes efforts to enhance the quality and reliability of its products, a product may fail or malfunction for a variety of reasons. please be sure to implement in your equipment using the products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any product, such as derating, redundancy, fire control and fail-safe designs. rohm shall bear no responsibility whatsoever for your use of any product outside of the prescribed scope or not in accordance with the instruction manual. the products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel- controller or other safety device). rohm shall bear no responsibility in any way for use of any of the products for the above special purposes. if a product is intended to be used for any such special purpose, please contact a rohm sales representative before purchasing. if you intend to export or ship overseas any product or technology specified herein that may be controlled under the foreign exchange and the foreign trade law, you will be required to obtain a license or permit under the law.
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